Introduction: Nowadays, the technology of LED lighting products is mature day by day, and the luminous efficiency of LED chips is increasing constantly, but the cost is decreasing continuously. And in the context of energy conservation and environmental protection and the government's vigorous publicity, the concept of consumers around the world is changing. All this is conducive to the popularization and promotion of LED lighting.
Laser as an advanced processing technology, using high energy density beam for cutting sapphire materials, has incomparable advantages.
LED sapphire substrate has many advantages: first, the sapphire substrate production technology is mature, the quality of the device; secondly, sapphire's stability is very good, can be used in high-temperature growth process; finally, the mechanical strength of sapphire is high, easy handling and cleaning.
Sapphire hardness is very high in natural materials and its hardness only to diamond, but in the process of making LED devices but it needs to be thinned and cutting, the cutting precision is calculated in m level, the process for sapphire cutting requirements put forward very high test.